France – Machines and apparatus with individual functions – Supply of 12µm ultrasonic wire cable machine
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Contract Description
The LAIP, Component Assembly and Integration Laboratory for Photonics, carries out wire cabling steps for its functional device packaging activities. The current evolution of performances and the miniaturization of pad sizes on chips leads us to supply a new wire cabling machine allowing ultrasonic welding with wires of 12μm versus 25μm standard on the current market This document defines our needs for the acquisition of a new machine. Overall it must allow cabling at a minimum in
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