Cure Anneal (IZM-139) - PR1233787-3460-P Cure Anneal (IZM-139) - PR1233787-3460-P

Cure Anneal (IZM-139) - PR1233787-3460-P Cure Anneal (IZM-139) - PR1233787-3460-P
1x Cure Anneal (IZM-139) The purpose of this equipment specification is to establish basic requirements for a curing/annealing oven with controllable temperature rises, a highly stable temperature process and a defined gas atmosphere for various substrate types and sizes (Si, glass with wafer sizes of 300mm and 200mm). Before the curing/annealing process, the wafers are delivered to the device in Front Opening Unified Pods (FOUPs), which are placed on the respective loading openings by the operator. The device must be able to carry out the following sequence of steps fully automatically: • Automatic unloading of the wafers from the FOUPs • Defined process steps in a temperature, pressure and gas-controlled area • Reloading the wafers to the starting position in the FOUP To ensure high throughput, the machine must be equipped with two loading openings. Programming of recipes must be possible within an appropriate range of options and parameters as required for research and development (R&D).