TZ Ref No.: TZ-1057074

Contract Award Awarded Contract National (NCB) United States Technology Hardware and Equipment Industrial Automation and Control Machinery and Equipments(M&E)

Semiconductor Die Bonding and Vacuum Packaging System

Doc ref no. N0017326P2436

Sector Technology Hardware and Equipment, Industrial Automation and Control, Machinery and Equipments(M&E)

Contract Date 16 Sep 2026

Contract Value $ 673K

Contract Intelligence

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Opportunity Notes Summarized from official procurement documents

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Contract Description

Award Notice Semiconductor Die Bonding and Vacuum Packaging System
This contract is awarded to COOK AND WEIL, INC. under simplified procedures for certain commercial items included in FAR subpart 13.5 for Semiconductor Die Bonding and Vaccuum Packaging System.

Procurement Requirements & Eligibility

Statutory qualifications, financial guarantees, and bidding compliance.

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Bid Security / Earnest Money Deposit (EMD)

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Tender Document Fee & Exemptions

Purchase fees, payment portal coordinates, and MSME/Startup waiver conditions.

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Financing & Multilateral Rules

Financed by World Bank / ADB / Domestic institutional budgets and governance frameworks.

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Bidder Eligibility & Financial Turnover

Minimum 3-year audited turnover threshold, similar contract certificates, and blacklisting declarations.

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Bid Submission & DSC Envelopes

Two-envelope digital signing specifications, fee submission deadline, and technical requirements checklist.

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Verified EMD Terms Turnover Rules DSC Submission Checklist

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Official Tender Documents

Official bidding notice, specifications, and AI intelligence summary.

3 Available Files

OFFICIAL NOTICE

Official Tender Notice & Bidding Specification VERIFIED SOURCE

TZ Ref: TZ-1057074 • Complete Official Notice Archive

AI BRIEF

AI Executive RFP Summary Brief PRO

Synthesized Executive Intelligence • Key Dates, Budget & Criteria

SOURCE ATTACHMENT

Original Procurement Portal Notice & Attachments

Direct link from Cook and Weil, Inc.

Open Official Source

Procurement Timeline & Key Deadlines

Notice Published

16 Sep 2026, 00:00

Tender notification officially published to portal

Bidding Window & Clarifications Open

Clarifications window locked

Opening date for submission of queries and tender documents

Submission Deadline

15 Dec 2026, 00:00

Final cutoff for sealed bid submission / e-portal upload

Contract Award Issued

16 Sep 2026

Formal contract award to selected contractor

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Days to Deadline

59 days

Closing: 15 Dec 2026, 00:00

Key Contract Details

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Semiconductor Die Bonding and Vacuum Packaging System

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Semiconductor Die Bonding and Vacuum Packaging System

Contract Description

Procurement Requirements & Eligibility

Unlock Automated AI Requirement Extraction

Official Tender Documents

Procurement Timeline & Key Deadlines

Consortium & JV Partners

Key Contract Details

Buyer Contact Information

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