Coordination and support office of the federal government in the field of microelectronics (“Chips Office”)
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Description & Project Overview
The BMWE intends to tender a contractor to temporarily establish a national chip office to accompany and support the Federal Government's measures in the field of microelectronics. The Chips Office has several core tasks, which are further specified in this service: 1. Organization and implementation of exchange formats 2.
Building analytical skills 3. Accompanying measures for the funded projects and measures 4. Strategic European and international networking Control of the Chips Office will be divided thematically between BMFTR and BMWE.