TZ Ref No.: TZ-66423EB
Laser cutter for wafer separation under liquid flow (PR1235038-3460-W)
Doc ref no.
54321-NetTender-19f5f993fbb-29f0f8dde2e24949
Sector
Services
Contract Date
20 Oct 2026
Contract Value
Undisclosed
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Opportunity Notes
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Contract Description
Internal identifier: PR1235038-3460-W Title: Laser cutter for wafer separation under liquid flow Description: PR1235038-3460-W Laser cutter for wafer separation under liquid flow Order type: Deliveries Description: Laser cutter for wafer separation under liquid flow
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