Germany – Laboratory, optical and precision equipments (excl. glasses) – Chemical-mechanical polishing machine
A structured breakdown of scope, eligibility requirements, submission steps, and key conditions — extracted directly from the official notice.
Sign in to unlock Bid Fit & AI Opportunity Intelligence
TenderZenith calculates a personalized qualification score against your company profile and extracts structured intelligence from tender documents with your 7-Day Pro Trial (No Credit Card Required).
Contract Description
The Friedrich Schiller University Jena intends to purchase a chemical-mechanical polishing machine (CMP) for polishing semiconductor and dielectric surfaces for optical applications for its scientific activities. It must be suitable for sample sizes up to wafers (semiconductor disks) with diameters of up to 100 millimeters and be able to achieve roughnesses of less than 1 nanometer (RMS roughness). This results in the following minimum requirements: see Appendix 2 The contracting authority reserves the right to submit offers with a total contract value of 225,000.00 euros