300 mm BEOL large field exposure system, fully automated (IZM-132) (PR1184859-3460-P)

Internal identifier: PR1184859-3460-P Title: 300 mm BEOL large field exposure system, fully automated (IZM-132) Description: 300 mm BEOL large field exposure system, fully automated (IZM-132) Order type: Supplies Description: 1 piece: 300 mm BEOL large field exposure system, fully automated (IZM-132) A 300 mm i-Line large field exposure system that provides the connection between FEOL lithography and back-end lithography and is aimed at producing ultra-high-density sub-µm BEOL structures, such as: B. Front and back panel wiring and connections for 2.5D/3D QMI and chiplet integration. This system can be used to realize ultra-high-density BEOL-like wiring on large-area, chiplet-based 2.5D/3D wafer-level systems and quasi-monolithic integrated package architectures. It enables state-of-the-art integration densities. The i-Line wide field exposure system bridges FEOL lithography and back-end lithography through medium numerical aperture (NA) optics with the largest possible field size and variable depth of field. It targets resolutions well below 1500 .. 2500 µm (LV-Pos.1.24) IR-based alignment on the back (reflection mode) with an overlap of ≤500 nm (3 sigma), essential for through-silicon vias (TSVs) and stacked wafer applications (LV-Pos.1.81) - Pre-alignment correction of center and rotation errors when the alignment marks are moved